Cerrolow 136, is a fusible alloy that becomes liquid at approximately 58 °C (136 °F). It is a eutectic alloy of bismuth, lead, indium, and tin, with the following percentages by weight: 49% Bi, 18% Pb, 21% In, 12% Sn.
It is also known as ChipQuik desoldering alloy.[1] and Lens Alloy 136, used for mounting lenses and other optical components for grinding.[2] Used for mounting small delicate oddly-shaped components for machining. It slightly expands on cooling, later shows slight shrinkage in couple hours afterwards. Used as a solder in low-temperature physics.[3]
The Young's Modulus is approximately 2.5×106 psi (17.24 GPa) [4]
- ^ Johnson Manufacturing Co, MSDS for Chip Quik Alloy w/Lead. Retrieved on February 6, 2015.
- ^ http://www.zilt.co.uk/LowMelting/LensAlloy136.html
- ^ Cite error: The named reference
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was invoked but never defined (see the help page). - ^ Similarity methods in engineering dynamics : theory and practice of scale modeling (Rev. ed.). Elsevier. p. 134. ISBN 0444598138.
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